Product Description
UV Fiber laser marking machine belongs to the series of laser marking machine. It is mainly used for ultra-fine marking and engraving. It is especially suitable for marking food, medical packaging materials, micropores, high-speed division of glass materials and silicon wafers. Wafers are used in applications such as complex pattern cutting.
Specification
| Specification | Parameters |
| Model | EO-IDDUV03 |
| Average output power | 3W |
| Peak power | 30KW |
| Repeat frequency range | 30-150KHz |
| Pulse width | 1~1000ns |
| Wavelength | 355nm |
| Beam diameter | 0.7mm |
Application
UV fiber laser marking machine is mainly based on its unique low-power laser beam. It is especially suitable for the high-end market of ultra-fine processing. The surface of packaging bottles for cosmetics, medicines, foods and other polymer materials is marked with fine results and clear and firm markings. Better than ink coding and no pollution; flexible pcb board marking, dicing; silicon wafer micro-hole, blind hole processing; LCD liquid crystal glass two-dimensional code marking, glassware surface drilling, metal surface plating marking, Plastic buttons, electronic components, gifts, communication equipment, building materials, etc.
